Deutsches Elektronen-Synchrotron DESY
A Research Centre of the Helmholtz Association

FE

System Design and Layout Development

The following technologies, circuit types and integration levels are applied in FEC. Design-related EDA/CAD tools from CADENCE and Mentor Graphics are used. In case of hybrid and monolithic microcircuits, designs will be submitted to external foundries for prototyping and mass production. We cooperate with several industrial foundry partners as well as research institutes. Our support also includes feasibility studies and developments up to system level. If you are looking for solutions related to these areas, please feel free to contact Karsten Hansen.

Integrated Circuits (IC)

  • CMOS

  • BiCMOS

0.35 µm-BiCMOS ASIC

Multi-Chip Modules (MCM)

  • Laminated PBC Technology (-L)

  • Ceramic Thick Film (-C)

  • Organic Thin Film (-D)

MCM-L Hybrid

Printed-Circuit Boards (PCB)

  • Rigid

  • Rigid Flex

  • Flex

14-Layer Board
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