URL: https://fe.desy.de/fec/activities/assembly/@@siteview
.
Breadcrumb Navigation
Assembly, Interconnection & Packaging
Our activities are focused on the assembly and microelectronic interconnection techniques using direct chip attachment, wire and flip-chip bonding, respectively. Manufacturing procedures are performed in a laboratory of about 150 m² and a cleanroom cabine. We offer these techniques for applications of different technologies.
- Chip-on-Board
- Chip-on-Flex or Rigid / Flex Systems
- Chip-on-Ceramics in Thick- and Thin-Film Technique
Assistance in chip and wire bonding is offered for prototyping and small-series production runs. FEC can also assist you choosing the technology and has experiences in the qualification of external vendors.
Assembly
- Die Bonding - Polymer Die Attach (Stencil Printing & Dispensing)
- SMD Mounting - Soldering
Interconnection
- Wire Bonding - Au-wire thermosonic ball-wedge, Al-/Au-wire ultrasonic wedge-wedge (semiautomatic)
- Bump Bonding - Au-stud (semiautomatic) & SAC305 Solder-Ball Placement (automatic)
- Test Methods - Pull-Shear Test, optical & 3-D Laser Inspection
Electromechanics
- Construction - Special housings & 3-D stacked Packages
- Assembly - Polymer-based Mounting
- Dimensioning - x-y-z Moving Systems with Camera
