Activity Fields of Work

  • Application Specific Integrated Circuit
  • Analog, Digital & Mixed-Signal Electronics
  • Monolithic & Hybrid Integrated Circuits
  • High-Speed Circuits



  • Chip-on-Board
  • Chip-on Flex or Rigid / Flex Systems
  • Chip-on-Ceramics in Thick- &
    Thin-Film Technique
  • Wire Bonding
  • Flip-Chip Bonding
  • Micro-Ball Placement
  • Probe Station-based Testing
  • DC & fast transient Signal Measurements
  • Temperature-dependent Measurements
  • Temperature-Cycling Tests
  • Implementation & Commissioning
  • Operation Services