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System Design and Layout Development
The following technologies, circuit types and integration levels are applied in FEC. Design-related EDA/CAD tools from CADENCE and Mentor Graphics and special tools from FPGA vendors are used. In case of hybrid and monolithic microcircuits, designs will be submitted to external foundries for prototyping and for mass production. We cooperate with several industrial foundry partners as well as research institutes. Our support also includes feasibility studies and developments up to system level. If you are looking for solutions related to these areas, please feel free to contact one of the listed members or Karsten Hansen.
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Analog, Digital and Mixed-Signal Hybrids
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Multi-Chip Modules utilizing Laminated printed-circuit board technique (MCM-L)
Circuit
Layout |
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Multi-Chip Modules utilizing Cofired ceramic thick-film technique (MCM-C ) |
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Multi-Chip Modules utilizing Deposited organic thin-film technique (MCM-D ) |
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Analog, Digital and Mixed-Signal Integrated Circuits
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Digital semi-custom ASICs |
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Mixed-Signal Interface Electronics
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Modules utilizing standard and laminated printed-circuit board (PCB and MCM-L) techniques
Circut
Layout |
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