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Characterization and Test
Electrical, optical as well as reliability test methods are used for characterization of devices, circuits and systems, which can aid in verification of simulation results. Testing and quality assessments are offered for prototyping and small-series production runs. Standard environmental aging test methods are used to study thermal and die attach integrity as well as reliability of interconnection techniques. Measurement procedures are carried out in a cleanroom-like laboratory.
The probe station-based Automated Test Equipment (ATE) performs on-wafer ASIC tests with up to 152 channels at bandwidths f 3dB > 500 MHz and rise times t r,20-80% < 700 ps.
Bandwidths up to 20 GHz of test equipment preserve signal integrity and timing information for transient characterizations of electrical as well as electro-optical high-speed components and circuits.
Digital oscilloscopes, pulse- and stimulus generators complete the ATE for digital real-time characterization and debugging up to 3 Gbit/s required in high-speed ICs, MCMs and PCBs.
Frequency-Dependent Impedance
Accurate material and component characterization are performed by impedance measurements from 10 µOhm to 100 MOhm, where test frequencies covers from 20 Hz to 100 MHz.
On-wafer DC current- and voltage measurements on solid-state circuits and devices are feasible in ranges of 10 fA to 100 mA and 2 microV to 100 V, respectively. Extracted parameters of underlying device models improve simulation performance.
Temperature-Dependent DC and AC tests and Reliability Testing
A computer controlled heating chamber provides MIL-spec temperature-controlled measurements as well as failure analysis of components and modules in the range -40 to +125°C.
