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Assembly, Interconnection and Packaging
Our activities are focused on the assembly and microelectronic interconnection techniques using direct chip attachment and wirebonding, respectively. Manufacturing procedures are performed in a cleanroom-like laboratory of about 150 m². We offer these techniques for applications of different technologies like
- Chip-on-Board
- Chip-on-Flex or Rigid / Flex Systems
- Chip-on-Ceramics in Thick- and Thin-Film Technique
Technological assistance in chip and wire bonding is offered for prototyping and small-series production runs. FEC can also assist you in choice of technology and has experiences in the qualification of external vendors. If you are looking for solutions related to one of the following areas, please do not hesitate to contact one of the listed members or Karsten Hansen.
- Die Bonding - Polymer Die Attach (Stencil Printing and Dispensing)
- SMD Mounting - Soldering
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- Wire Bonding - Au-wire thermosonic ball-wedge, Al-/Au-wire ultrasonic wedge-wedge (semiautomatic)
- Bump Bonding - Au-stud
- Quality Assurance - Pull tests, optical inspections, electrical tests
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- Construction - Special cases and 3D-stacked packages
- Assembly - Polymer-based Mounting
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- High-Precision Placement - Flip-chip fineplacer (micron range)
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- Optical Inspection - Interference-contrast microscopy (micron range) ,
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- High Precision 3D Measurement - YXZ-table with microscopy (micron range over 30 cm)
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