URL: https://fe.desy.de/fec/facilities/@@siteview
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Facilities
Assembly and microelectronic packaging techniques as well as electrical, optical or reliability test methods are carried out in a laboratory of about 150 m² with a cleanroom cabine (ISO6/ 1000).
Probing |
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Manual PM5 Probe Station |
Manual PM8 Probe Station |
Automatic PA300 Probe Station |
Inspection
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Optical IC Microscopy
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Laserscan Microscope |
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Mechanics
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Pull-Shear-Tester |
X-Y-Z Linear-Table-System |
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Bonding |
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Semiautomatic Wire Bonder |
Solder Ball Placement System |
Automated Sub-micron Die Bonder |
Selection Guide of Equipment
Some components of the following equipment catalogue are installed in the lab or are temporarily implemented in remotely controlled measurement systems for project-related test purposes.
EDA/ CAD |
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ASIC design
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Board design
Mechanic design
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Assembly, Interconnection & Packaging |
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Optical Inspection & Profilometry Microscopy
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Placement/Bonding Tools
Bumping Tool
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Characterization and Test |
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ATE
Generators
Noise Generator
Analyzers
Spectrum Analyser
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Oscilloscopes
Optical Spectrum Analyzer
Universal Counter
Multi-/Voltmeters
Temperature Test Chamber
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